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BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
Features:
1. Emitted Color : Yellow Green 2. Lens Appearance : Water Clear. 3. Mono-color type. 4. 1.6x0.8x0.8mm(0603) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn't contain restriction Substance, comply ROHS standard.
Package Dimensions:
Applications:
1. Automotive : Dashboards, stop lamps, turn signals. 2. 3. Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is 0.10mm (0.004") unless otherwise specified. 3.Specifications are subject to change without notice.
4. General use. Absolute Maximum Ratings(Ta=25)
Parameter
Power Dissipation Forward Current Peak Forward Current 1 Reverse Volage Operating Temperature Storage Temperature Soldering Temperature Derating Linear From 25 Infrared Soldering Condition Vapor Soldering Condition
Symbol
Pd IF IFP VR Topr Tstg Tsol -
Rating
80 30 100 5 -55~85 -55~85 See Page6 0.6 240(for 10 Seconds) 215(for 3Minutes)
Unit
mW mA mA V mA/ -
1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
Ver.2.1 Page 1 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
Max.
2.6 100 576
Electrical and optical characteristics(Ta=25) Parameter
Forward Voltage Luminous Intensity Reverse Current Peak Wave Length Dominant Wave Length Spectral Line Half-width Veiwing Angle
Symbol
Vf Iv IR p d 21/2
Condition
IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA IF=20mA
Min.
3.7 566 -
Typ.
2.0 10.0 568
Unit
V mcd A nm nm nm deg
30 120
-
Typical Electro-Optical Characteristics Curves
Fig.1 Relative intensity vs. wavelength
1.0 60
Fig.2 Forward current derating curve vs. ambient temperature
50
Relative radiant intensity
Forward current (mA)
40
0.5
30
20
10
0
515
568
615
0
20
40
60
80
100
Wavelength (nm)
Ambient temperature Ta( C)
Fig.3 Forward current vs. forward voltage
50 3.0
Fig.4 Relative luminous intensity vs. ambient temperature
40
2.5 Relative Luminous intensity (Normalized @20mA)
Forward current (mA)
2.0
30
1.5
20
1.0
10
0.5
0
1
2
3
4
5
0 -40
-20
0
20
40
60
Forward voltage(V)
Ambient temperature Ta( C)
Fig.5 Relative luminous intensity vs. forward current
4.0
RADIATION DIAGRAM
0 10 20 30
Relative luminous intensity (@20mA)
3.0
RELATIVE RADIANT INTENSITY
40 1.0 0.9 0.8 50 60 70 0.7 80 90
2.0
1.0
0
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.2.0 Page 2 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
Tapping and packaging specifications(Units: mm)
USER DIRECTION OF FEED 1.04 0.1 1.08 0.1 ANODE START END 71.0 0.1 13.0 0.5
1.88 0.1
13.0 0.5
5.3 0.05
8.0 0.3
CATHODE
4.0 0.1 4.0 0.1
1.5 0.1 2.0 0.05
1.75 0.1
3.5 0.05
TRAILER
LEADER 0.3 FIXING TAPE
NOTE: 3000 pcs PER REEL
Package Method:(unit:mm)
12 bag/box 3000 pcs/reel
200
Bar Code Label
245 220 187
220
Aluminum Foil Bag
645
6 box/carton
210 470
Ver.2.0 Page 3 of 7
179 1
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (mcd)
G H J K 3.2 4.8 7.0 11 . 0
Max. (mcd)
6.3 9.4 14.0 21.0
C o l o r B i n L i m i ts ( A t 2 0 m A ) BIN CODE
4 5 6 7 8
Min. (mcd)
565 567 569 571 573
Max. (mcd)
569 571 573 575 577
B IN x
x
Color BIN CODE
Intensity BIN CODE
Ver.2.0 Page 4 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
Reliability Test
Classification Test Item Operation Life Reference Standard MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 MIL-STD-202:103B JIS-C-7021 :B-11 MIL-STD-883:1008 JIS-C-7021 :B-10 JIS-C-7021 :B-12 Test Conditions Ta=Under RoomTemperature As Per Data Sheet Maximum Rating Test Time=1000HRS(-24HRS,+72HRS) 20mA Ta=+655 RH=90%-95% Test time=240hrs2HRS High Ta=+1055 Test time=1,000hrs(-24HRS,+72HRS) Low Ta=-555 Test time=1,000hrs(-24HRS,+72HRS) +105 ~ +25 ~ -55 ~ +25 30min 5min 30min 5min Test Time=10cycle IR-Reflow In-Board, 2 (10min)~-405(10min) Test Time=10cycle T.sol=2605 Dwell Time=101secs Times 855 0/20 Result 0/20
Endurance Test
High Temperature High Humidity Storage High Temperature Storage Low Temperature Storage Temperature Cycling
0/20
0/20
0/20
Thermal Shock
Solder Resistance Environmental IR-Reflow Test
MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1011 MIL-STD-202:201A MIL-STD-750:2031 JIS-C-7021 :A-1 -
0/20
0/20 0/20 0/20 0/20 0/20 0/20 0/20 0/20 0/20 0/20 0/20
Solderability
-
Solderability -
Ramp-up rate(183 to Peak)+3 1sec max Temp maintain at12525 120sec max Temp maintain above 183 60150sec Peak temperature range 235240 Time within5 of actual Pwck Temperature10-30sec Ramp-down rate+6 1sec max T.sol=2355 Immesion time 20.5sec Immesion rate 252.5mm/sec Coverage95% of the dipped surface
Judgment criteria of failure for the reliability
Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5
Note:
1.U means the upper limit of specified characteristics.
S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test.
Ver.2.0 Page 5 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
Soldering :
1. Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140~1605,within 2 minutes. Operation heating : 235(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching).
5 SEC. MAX.
3. DIP soldering (Wave Soldering) : Preheating : 120~150,within 120~180 sec. Operation heating : 2455 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching).
Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook.
Temperature
140~160
260 MAX. 4 /SEC. MAX.
4 /SEC. MAX. OVER 2 MIN.
Time
Soldering heat Max. 260 120~150 245 5 within 5 sec.
Temperature
Preheat 120~180 sec.
Time
Ver.2.0 Page 6 of 7
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-HG036D-TRB
Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs.
Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5-30(41)Humidity : RH 60Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 603.
Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label:
BRIGHT LED LOGO
Customer: xxx Cus Part.NO: XX Material No: BL-Hxxxxx-TRB
Part No. Quantity BIN.
Quantity:xxxx
Batch(BIN): x
Sealing date:xxxxxx
Lot NO:X
x
Sealing Date xx xx xx Year Month Day
Manufacture Location
Ver.2.0 Pag 7 of 7

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